1 ? fn6216.0 ISL55009 mmic silicon bipolar broadband amplifier the isl55005, isl55007, isl55008 and ISL55009, isl55010, isl55011 constitute a family of high performance gain blocks featuring a darlington configuration using high f t transistors and excellent ther mal performance. they are an ideal choice for dvb-s lnb cable receiver applications. isl55005, isl55007, isl55008 offer higher oip3 performance while the ISL55009, isl55010, isl55011 offer lower operating supply currents. isl55005 and ISL55009 match a 75 ? source to a 50 ? load. isl55007 and isl55010 match a 75 ? source to a 75 ? load. isl55008 and isl55011 match a 50 ? source to a 50 ? load. features ? input impedance of 75 ? ? output impedance of 50 ? ? noise figure of 3.7db ? oip3 of 10dbm ? low supply current of 14ma ? low input and output return losses ? pb-free plus anneal available (rohs compliant) applications ? lnb and lnb-t line amplifiers ? if gain blocks for satellite and terrestrial hdtv stbs ? pa driver amplifier ? wireless data, satellite ? bluetooth/wifi ? satellite locator and signal strength meters ordering information part number (note) part marking tape & reel package (pb-free) pkg. dwg. # ISL55009iez-t7 cbf 7? (3k pcs) 6 ld sc-70 p6.049 note: intersil pb-free plus anneal products employ special pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish , which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free products are msl classi fied at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. typical application circuit pinout 6 ld sc-70 100pf 0.1f 100nh 100pf 0.1f 68pf 68pf 1, 2, 5 3 4 6 +3.3v gnd gnd in 1 2 3 6 5 4 out gnd vsp data sheet may 22, 2006 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2006. all rights reserved. all other trademarks mentioned are the property of their respective owners.
ISL55009 2 fn6216.0 may 22, 2006 important note: all parameters having min/max specifications are guaranteed. typ values are for information purposes only. unles s otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: t j = t c = t a device test setup absolute m aximum ratings (t a = 25c) supply voltage from vsp to gnd . . . . . . . . . . . . . . . . . . . . . . . . 6v input voltage . . . . . . . . . . . . . . . . . . . . . . . v s + +0.3v to gnd -0.3v power dissipation . . . . . . . . . . . . see packging information section ambient operating temperature . . . . . . . . . . . . . . . .-40c to +85c storage temperature . . . . . . . . . . . . . . . . . . . . . . . .-65c to +125c operating junction temperature . . . . . . . . . . . . . . . . . . . . . . +125c esd rating human body model (per mil-std-883 method 3015.7) . . .3000v machine model (per eiaj ed-4701 method c-111). . . . . . . .300v caution: stresses above those listed in ?absolute maximum ratings? may cause permanent damage to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. electrical specifications vsp = +3.3v, zrsc = zload = 50 ? , ta = 25c, unless otherwise specified. parameter description conditions min typ max unit gt small signal gain 1.0ghz 14.8 15.8 16.8 db 1.5ghz 14.6 15.6 16.6 db 2.0ghz 14.3 15.3 16.3 db p1db output power at 1db compression 1.0ghz -0.4 1.1 2.6 dbm 2.0ghz -0.7 0.8 2.3 dbm oip3 output third order intercept point 1.0ghz 10.6 dbm 2.0ghz 10.0 dbm bw 3db bandwidth 3db below gain @ 500mhz 3.2 ghz irl input return loss 1.0ghz zrsc = 75 ?, zload = 50 ? 11.1 db orl output return loss 1.0ghz zrsc = 75 ?, zload = 50 ? 13.6 db risol reverse isolation 2.0ghz 21.0 db nf noise figure 2.0ghz 3.7 db id device operating current 11.5 13.7 15.5 ma 50 ? 50 ? 50 ? 50 ? 3.3v vna dc block dut bias tee 3.3v power supply picosecond labs model 5508-110 picosecond labs model 5542 connectorless platform agilent _8753es input reference plane output reference plane i 1 i 2 i device pin 3 pin 6
ISL55009 3 fn6216.0 may 22, 2006 typical performance curves z src = 75 ? , z load = 50 ? figure 1. input return loss vs frequency f igure 2. output return loss vs frequency 0 2 4 6 8 10 12 14 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) irl (db) . 0 2 4 6 8 10 12 14 16 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) orl (db) typical performance curves 50 ? environment figure 3. |s21| vs frequency figure 4. |s11| vs frequency figure 5. |s12| vs frequency figure 6. |s22| vs frequency 10 12 14 16 18 20 0.5 1.0 1.5 2.0 2.5 3.0 frequency ( ghz ) s21 (db ) -10 -9 -8 -7 -6 -5 0.5 1.0 1.5 2.0 2.5 3.0 frequency ( ghz ) s11 (db ) -24 -23 -22 -21 -20 -19 -18 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) s12 (db ) -12 -11 -10 -9 -8 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) s22 (db )
ISL55009 4 fn6216.0 may 22, 2006 figure 7. oip3 vs frequency figure 8. p1dbm vs frequency figure 9. noise figure vs frequency figure 10. s11 and s22 vs frequency typical performance curves 50 ? environment (continued) 9 10 11 12 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) oip3 (dbm) 0 1 2 3 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) dbm 0 1 2 3 4 5 6 0.5 1.0 1.5 2.0 2.5 3.0 frequency (ghz) noise figure (db) 2 0 20 1.0 0 . 9 0 . 8 0 . 7 0 . 6 0 . 5 0 . 4 0 . 3 0 . 2 0 . 1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.2 1.4 1.6 1.8 2.0 3.0 4.0 5.0 10 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 1 . 2 1 . 4 1 . 6 1 . 8 2 . 0 3 . 0 6 . 0 7 . 0 8 . 0 9 . 0 5 0 1 0 5 . 0 4 . 0 2 0 1.0 0 . 9 0 . 8 0 . 7 0 . 6 0 . 5 0 . 4 0 . 3 0 . 2 0 . 1 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 1. 2 1 . 4 1 . 6 1 . 8 2 . 0 3 . 0 6 . 0 7 . 0 8 . 0 9 . 0 5 0 1 0 5 . 0 4 . 0 50 rf caf 2002 s 22 s 11 0.5 ghz 1.0 2.2 3 ghz 0.5 ghz 1.0 2.2 3 ghz
ISL55009 5 fn6216.0 may 22, 2006 packaging information figure 11. package power dissipation vs ambient temperature jedec jesd51-7 high effective thermal conductivity test board 176mw j a = 5 6 7 c / w s c 7 0 - 6 power dissipation (w) 0.3 0 0 ambient temperature (c) 150 75 25 100 50 125 85 0.25 0.1 0.2 jedec jesd51-7 high effective thermal conductivity test board power dissipation (w) 0 0 ambient temperature (c) 150 75 25 100 50 125 85 0.15 0.05
ISL55009 6 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn6216.0 may 22, 2006 small outline transistor plastic packages (sc70-6) d e1 e c l e b c l a2 a a1 c l 0.20 (0.008) m 0.10 (0.004) c c -c- seating plane 12 3 4 5 6 e1 c l c view c view c l r1 r 4x 1 4x 1 gauge plane l1 seating l2 c plane c base metal with c1 b1 plating b p6.049 6 lead small outline transistor plastic package symbol inches millimeters notes min max min max a 0.031 0.043 0.80 1.10 - a1 0.000 0.004 0.00 0.10 - a2 0.031 0.039 0.00 1.00 - b 0.006 0.012 0.15 0.30 - b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 d 0.073 0.085 1.85 2.15 3 e 0.071 0.094 1.80 2.40 - e1 0.045 0.053 1.15 1.35 3 e 0.0256 ref 0.65 ref - e1 0.0512 ref 1.30 ref - l 0.010 0.018 0.26 0.46 4 l1 0.017 ref. 0.420 ref. l2 0.006 bsc 0.15 bsc n6 65 r 0.004 - 0.10 - r1 0.004 0.010 0.15 0.25 0 o 8 o 0 o 8 o - rev. 2 9/03 notes: 1. dimensioning and tolerance per asme y14.5m-1994. 2. package conforms to eiaj sc70 and jedec mo203ab. 3. dimensions d and e1 are exclusiv e of mold flash, protrusions, or gate burrs. 4. footlength l measured at reference to gauge plane. 5. ?n? is the number of terminal positions. 6. these dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. controlling dimension: millimeter. converted inch dimen- sions are for reference only
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